Heat conducting paste silicone compound

Heat conductive grease For Laptop pc notebook desktop computer CPU GPU chipsets Non-toxic heat sink compound Factory price.

Features                                                                                   Applications                             

.Thermal conductivity: 2.0/3.0/5.0 W/M-K                       . CPU and Chipset cooler                    

. Low thermal resistance                                                  . Switching power supply

. REACH, RoHS & UL compliance                                  . Electronic Home compliance

                                                                                               . LED industry

                                                                                               . Others

        

Store Method:

 . This item can be saved for 18 months when it is sealed under room temperature 25°C.

 

Physical Properties:

PROPERTY	G-200	G-300	G-500	TEST METHOD	UNIT
Density	2.3	2.7	3.2	ASTM D792	---
Color	Gray	Gray	Gray	---	Visual
Volatile Content	0.5	0.3	0.2	ASTM E595	%/Wt
Thermal Conductivity	2.0	3.0	5.0	ASTM D5470	W/mK
Thermal Resistance	0.041	0.025	0.009	ASTM D5470	C-In2/W
Breakdown Voltage	1100	1000	600	ASTM D149	VAC/mil
Dielectric Constant	4.5	4.7	4.8	ASTM D150	---
Volume Voltage	>1013	>1013	>1012	ASTM D257	---
Work Temp	-50°C  to  200°C

Heat conducting paste silicone compound